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10+ Layer HDI PCB Production Record #HDI-20260526-028

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PCB Specifications

Parameter Value Parameter Value
PCB Type HDI PCB Quantity 250 pcs
Layers 10 Layers Board Type Panel PCB
Dimensions 80 x 80 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.1mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No
HDI Structure 1 Blind/Buried Vias Yes

Manufacturing Timeline

Order Created
Apr 08 16:46
Files Ready
Apr 08 16:46
Engineering Review Completed
Apr 08 16:57
Payment down
Apr 09 14:06
Production Started
Apr 29 10:31
Production Completed
May 26 15:18
Progress: 0/6
Engineering Review time: 0.2 h Multiple File Revisions
Production time: 27.2d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.3 h
Carrier
FedEx IP
Destination
POLAND
Shipping Method
Express Air
Shipping Time
May 26 15:36

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Sequential Lamination
08
Laser Microvia Drilling
09
Via Filling & Plating
10
Solder Mask Application
11
Electroless Nickel Deposition
12
Immersion Gold Deposition
13
Panelization Optimization
14
Batch AOI Inspection
15
Yield Control Management
16
Electrical Testing

Manufacturing Summary

We manufactured 250 pieces of these 10-layer HDI PCBs in panel format, each board measuring 80 × 80 mm with 1.6 mm thickness and 1 oz copper weight. The design included blind vias, a custom stackup, 4/4 mil minimum track and spacing, and 0.1 mm minimum hole size. These tighter geometries required precise inner layer imaging, circuit etching, and layer stack alignment to maintain registration across all ten layers during high pressure lamination.

 

Green soldermask and white silkscreen were applied prior to electroless nickel and immersion gold deposition, producing a uniform ENIG surface finish suited for reliable assembly. Each production stage—from material preparation through solder mask application and final electrical testing—was executed according to the specified parameters. Batch AOI inspection verified trace integrity and hole quality on every panel.

 

The 27.2-day schedule allowed thorough verification at each checkpoint for this moderate-volume run. All delivered panels met the custom stackup and blind via requirements, providing the customer with consistent multilayer boards ready for immediate use.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
HDI-20260729-036 HDI PCB 8 97 x 93.4 Black ENIG (Immersion Gold) 100 View detail
HDI-20260720-0001 HDI PCB 8 188 x 100 Matte Black ENIG (Immersion Gold) 125 View detail
HDI-20260718-0002 HDI PCB 4 37 x 26.6 Green ENIG (Immersion Gold) 20 View detail

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