PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | HDI PCB | Quantity | 200 pcs |
| Layers | 18 Layers | Board Type | Panel PCB |
| Dimensions | 22 x 14 mm | Copper Weight | 1oz |
| Thickness | 2.2 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.25mm |
| Solder Mask | Green | Silkscreen | None |
| HDI Structure | 2 | Blind/Buried Vias | Yes |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This production record covers 200 panels of 18-layer HDI PCBs with blind vias and a custom stackup. The boards measure 22 x 14 and were built to a 2.2 mm thickness using 1 oz copper, with minimum 5/5 mil track and spacing. During inner layer imaging, circuit etching, and high-pressure lamination, strict registration tolerances were maintained to ensure via reliability in this complex multilayer construction.
Green soldermask was applied before electroless nickel and immersion gold deposition to produce a uniform ENIG surface finish. No silkscreen was required. Comprehensive electrical testing followed to verify all interconnects and insulation properties across the panels.
The 20.2-day production cycle accommodated the detailed steps necessary for these thicker, high-layer-count immersion gold ENIG boards. Every panel in the run met the dimensional and electrical criteria, supporting consistent performance in the intended application.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| HDI-20260729-036 | HDI PCB | 8 | 97 x 93.4 | Black | ENIG (Immersion Gold) | 100 | View detail |
| HDI-20260720-0001 | HDI PCB | 8 | 188 x 100 | Matte Black | ENIG (Immersion Gold) | 125 | View detail |
| HDI-20260718-0002 | HDI PCB | 4 | 37 x 26.6 | Green | ENIG (Immersion Gold) | 20 | View detail |
