8 Layer HDI PCB Production Record #HDI-20260605-0001

This order comprised 40 panels of an 8-layer HDI circuit board measuring 65.5 × 50 mm with 1.8 mm finished thickness and 2 oz copper on all layers. The custom stackup incorporated blind vias in a 2-step structure, produced through sequential lamination and laser microvia drilling after precise layer stack alignment. Minimum 6/6 mil track spacing and 0.2 mm holes followed conventional geometry, allowing the process flow to concentrate on via filling, plating, and maintaining registration across the heavier copper weights during high-pressure lamination cycles.

Inner layer imaging and circuit etching preceded thick copper electroplating and controlled etching to protect trace profiles. Black solder mask with white silkscreen was applied over the immersion gold ENIG surface finish, delivering uniform coverage and reliable pad solderability. Every panel completed comprehensive electrical testing, verifying continuity and isolation across the HDI interconnections.

The 28.9-day production schedule accommodated the multiple plating, drilling, and lamination steps required by this configuration. Resulting boards exhibited consistent quality and dimensional stability, meeting all specified parameters for the custom HDI design without impedance control.