6 Layer HDI PCB Production Record #HDI-20260616-0001

During manufacturing of this 6-layer HDI board order, our team processed 30 panels using sequential lamination to accommodate the blind vias and single-step HDI structure. The boards presented a compact 28 x 33 mm footprint at 1.6 mm thickness with 1 oz copper weight. The 5/5 mil track and spacing combined with 0.25 mm minimum hole size required precise laser microvia drilling after material preparation and accurate layer stack alignment.

Inner layer imaging and circuit etching were completed prior to high pressure lamination. Via filling and plating followed before solder mask application, electroless nickel deposition, and immersion gold steps created a uniform ENIG surface finish. Green soldermask with white silkscreen met the specified appearance while maintaining registration across the panelized HDI PCB array.

Electrical testing at the end of the 17.3-day production cycle verified continuity on every panel. The executed processes delivered consistent results that aligned with the design parameters for this HDI PCB without impedance control.