PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | HDI PCB | Quantity | 500 pcs |
| Layers | 8 Layers | Board Type | Panel PCB |
| Dimensions | 152.5 x 114 mm | Copper Weight | 2oz |
| Thickness | 1.8 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Matte Black | Silkscreen | White |
| HDI Structure | 3 | Blind/Buried Vias | Yes |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
The manufacturing of these 8-layer HDI boards involved processing 500 panels, each measuring 152.5 by 114 mm with a finished board thickness of 1.8 mm. A custom stackup with 2oz copper weight supported the 3-step HDI structure that included blind vias. Sequential lamination combined with laser microvia drilling and via filling ensured precise interconnections across the layers.
Standard 6/6 mil geometry allowed conventional imaging and etching processes despite the heavier copper. Matte black soldermask and white silkscreen were applied over the surface, followed by immersion gold ENIG finishing to deliver reliable pad quality and protection. Thick copper electroplating steps were carefully controlled to maintain trace integrity.
Electrical testing and batch AOI inspection verified all 500 panels over the 47-day production period. This execution delivered consistent HDI PCB results matching the specified custom requirements without impedance control.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| HDI-20260729-036 | HDI PCB | 8 | 97 x 93.4 | Black | ENIG (Immersion Gold) | 100 | View detail |
| HDI-20260720-0001 | HDI PCB | 8 | 188 x 100 | Matte Black | ENIG (Immersion Gold) | 125 | View detail |
| HDI-20260718-0002 | HDI PCB | 4 | 37 x 26.6 | Green | ENIG (Immersion Gold) | 20 | View detail |
