8 Layer HDI PCB Production Record #HDI-20260710-0004

This production record details an 8-layer HDI board built as panels in a quantity of 40. Measuring 37 × 42 mm with 1.6 mm thickness and 2 oz copper weight, the custom stackup incorporated blind vias in a 3-step HDI configuration. Sequential lamination and laser microvia drilling were performed after material preparation and inner layer imaging, followed by via filling, plating, and thick copper electroplating to maintain structural integrity across the multilayer construction.

With standard 6/6 mil track and spacing, the circuit etching process was adjusted for the heavier copper to prevent undercut while preserving trace accuracy. A matte black solder mask with white silkscreen was applied before electroless nickel deposition and immersion gold ENIG surface finish, providing reliable solderability for the specified board type. The 20-day production window allowed methodical layer stack alignment, high-pressure lamination, and controlled copper etching at each stage.

Final electrical testing verified all interconnections and confirmed consistent performance across the delivered panels. Every process step was executed to match the custom HDI requirements, resulting in stable via plating and layer registration that met the order’s technical demands.