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4 Layer Rigid-Flex PCB Production Record #RFP-20240618-0025

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 250 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 38.95 x 40.24 mm Copper Weight 1OZ
Thickness 1 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.25mm
Solder Mask Black Silkscreen White

Manufacturing Timeline

Order Created
Mar 13 07:49
Files Ready
Mar 13 07:49
Engineering Review Completed
Mar 13 08:25
Payment down
Mar 18 14:23
Production Started
Mar 18 14:30
Production Completed
Apr 05 16:42
Progress: 0/6
Engineering Review time: 0.7 h
Production time: 18.1d

Logistics Information

Production Completed→Shipping : 73.9d
Carrier
DHL
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Jun 18 14:06

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Panelization Optimization
14
Batch AOI Inspection
15
Yield Control Management
16
Electrical Testing

Manufacturing Summary

This production record covers a batch of 250 rigid-flex panels, each a compact 4-layer construction measuring 38.95 × 40.24 mm with 1.0 mm finished thickness and 1OZ copper. The design used standard 6/6 mil track and spacing, 0.25 mm minimum holes, black soldermask, white silkscreen, and immersion gold ENIG surface finish. These parameters required exact control during material preparation and layer transitions to maintain alignment between rigid FR4 zones and flexible sections across the panelized format.

 

Inner layer imaging, circuit etching, and flex-rigid lamination were sequenced with high-pressure cycles to secure bond integrity at the junction lines. Controlled depth routing produced clean board outlines while protecting flex areas, followed by electroless nickel and immersion gold deposition for uniform pad coverage. Dynamic flex reliability testing, batch AOI inspection, and 100% electrical testing verified mechanical endurance and electrical continuity throughout the lot.

 

The 18.1-day schedule permitted full validation at each stage, resulting in consistent layer registration and surface quality suited to applications requiring both stability and repeated flexing. This execution reflects practical manufacturing considerations for small-form rigid-flex PCBs with ENIG finish from initial stack alignment to final delivery.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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