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4 Layer Rigid-Flex PCB Production Record #RFP-20240702-0037

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 5 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 152 x 170.7 mm Copper Weight 1OZ
Thickness 1 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Jun 04 14:59
Files Ready
Jun 04 15:00
Engineering Review Completed
Jun 05 10:23
Payment down
Jun 04 14:59
Production Started
Jun 05 10:24
Production Completed
Jul 02 15:18
Progress: 0/6
Engineering Review time: 0.9d
Production time: 27.3d

Logistics Information

Production Completed→Shipping : 1 min
Carrier
FedEx IP
Destination
LITHUANIA
Shipping Method
Express Air
Shipping Time
Jul 02 15:18

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

For this rigid-flex PCB order, five 4-layer panels sized 152 x 170.7 mm were produced using 1 oz copper and a 1 mm board thickness. Specifications included a standard 6/6 mil minimum track and spacing, 0.3 mm holes, green solder mask with white silkscreen, and immersion gold ENIG finish. The hybrid construction called for precise flex-rigid lamination to ensure seamless integration between the flexible polyimide and rigid FR4 areas.

 

Manufacturing steps encompassed material preparation, inner layer imaging, high pressure lamination, solder mask application, electroless nickel and immersion gold deposition, and controlled depth routing. Dynamic flex reliability testing was executed to confirm the panels could endure repeated flexing, while electrical testing verified continuity and isolation across all layers.

 

Spanning 27.3 days, the production allowed for careful process monitoring on this small batch, resulting in consistent outcomes that satisfied the technical demands of the rigid-flex design. The boards were completed with reliable layer alignment and surface quality suitable for end-use applications.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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