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4 Layer Rigid-Flex PCB Production Record #RFP-20240717-0034

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 20 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 87.7 x 47 mm Copper Weight 1OZ
Thickness 1 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.25mm
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Jun 21 08:18
Files Ready
Jun 21 08:18
Engineering Review Completed
Jun 21 08:27
Payment down
Jun 26 16:07
Production Started
Jun 26 16:07
Production Completed
Jul 17 11:16
Progress: 0/6
Engineering Review time: 9 min
Production time: 20.8d

Logistics Information

Production Completed→Shipping : 2 min
Carrier
DHL
Destination
POLAND
Shipping Method
Express Air
Shipping Time
Jul 17 11:18

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This production run delivered 20 panels of 4-layer rigid-flex PCB, sized at 87.7 × 47 mm with 1 mm thickness and 1 oz copper throughout. Standard 6/6 mil track and spacing were paired with 0.25 mm minimum holes, green soldermask, white silkscreen, and immersion gold ENIG surface finish. These choices supported reliable component attachment while accommodating the mixed rigid and flexible material stack required for the design.

 

Manufacturing followed a disciplined sequence of inner layer imaging, circuit etching, and high-pressure lamination before the critical flex-rigid lamination step. Precise layer stack alignment prevented misalignment at the transition zones. Controlled depth routing accurately defined the flexible areas, after which dynamic flex reliability testing confirmed the panels could endure repeated bending cycles without trace fracture or delamination.

 

Electroless nickel and immersion gold deposition produced a uniform, oxidation-resistant finish across all panels. Final electrical testing verified continuity and isolation on every board. The complete order was executed in 20.8 days, resulting in consistent rigid-flex circuits that matched the customer's mechanical and electrical requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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