PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Rigid-Flex PCB | Quantity | 120 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 28 x 18.5 mm | Copper Weight | 1OZ |
| Thickness | 0.3 mm | Min Track / Spacing | 3/3mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.1mm |
| Solder Mask | Black | Silkscreen | White |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
For this order of 120 four-layer rigid-flex panels, production focused on a thin 0.3 mm board thickness with 3/3 mil track spacing, 0.1 mm holes, and blind vias. Measuring 28 x 18.5 mm and built on 1 oz copper, the panels featured distinct rigid and flex areas. Black soldermask, white silkscreen, and immersion gold ENIG surface finish were applied to meet design criteria.
Manufacturing followed a sequence of engineering review, precise layer imaging and etching, flex-rigid lamination, and high-pressure bonding to maintain alignment and reliability. Controlled depth routing accurately formed the panel outlines. Solder mask application and ENIG deposition provided durable surface protection.
Dynamic flex reliability testing, in addition to electrical testing, verified the boards could endure mechanical stress without performance loss. This execution delivered consistent rigid-flex PCBs tailored to the tight geometries and thin profile specified.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| RFP-20260626-0002 | Rigid-Flex PCB | 4 | 100 x 106.01 | Green | ENIG (Immersion Gold) | 5 | View detail |
| RFP-20260608-0005 | Rigid-Flex PCB | 4 | 22.15 x 97.92 | Green | ENIG (Immersion Gold) | 20 | View detail |
| RFP-20260606-0038 | Rigid-Flex PCB | 4 | 180 x 120 | Black | ENIG (Immersion Gold) | 5 | View detail |
