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4 Layer Rigid-Flex PCB Production Record #RFP-20241008-0047

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 120 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 53 x 163 mm Copper Weight 1OZ
Thickness 1 mm Min Track / Spacing 5/5mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.25mm
Solder Mask Yellow Silkscreen White

Manufacturing Timeline

Order Created
Jul 29 10:40
Files Ready
Jul 29 10:40
Engineering Review Completed
Jul 29 11:14
Payment down
Jul 30 21:48
Production Started
Jul 31 10:01
Production Completed
Aug 19 15:06
Progress: 0/6
Engineering Review time: 0.6 h
Production time: 19.3d

Logistics Information

Production Completed→Shipping : 50.1d
Carrier
DHL
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Oct 08 15:55

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This rigid-flex PCB order comprised 120 four-layer boards measuring 53 × 163 mm with 1.0 mm thickness and 1 oz copper. The 5/5 mil minimum track and spacing required precise inner layer imaging, etching, and stack alignment to maintain feature integrity across rigid-to-flex transitions. Yellow soldermask, white silkscreen, and immersion gold ENIG surface finish were applied, with plating parameters adjusted to achieve uniform nickel and gold deposition on both material types.

 

Flex-rigid lamination and high-pressure bonding were sequenced to prevent stress concentrations at the junction zones, followed by controlled depth routing for clean outlines. Dynamic flex reliability testing subjected the boards to repeated bend cycles while electrical testing verified net continuity and isolation on every unit, confirming zero defects across the full lot.

 

Completed in 19.3 days, the run delivered consistent rigid-flex PCBs that satisfied all dimensional, mechanical, and electrical requirements for applications combining stable circuitry with dynamic flexing sections.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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