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4 Layer Rigid-Flex PCB Production Record #RFP-20241111-0069

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 50 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 28 x 18.5 mm Copper Weight 1OZ
Thickness 0.3 mm Min Track / Spacing 3/3mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.1mm
Solder Mask Black Silkscreen White

Manufacturing Timeline

Order Created
Aug 13 14:57
Files Ready
Engineering Review Completed
Aug 13 15:40
Payment down
Aug 16 00:41
Production Started
Aug 16 00:44
Production Completed
Aug 21 14:38
Progress: 0/6
Engineering Review time: 0.8 h
Production time: 5.6d

Logistics Information

Production Completed→Shipping : 1h
Carrier
DHL
Destination
FINLAND
Shipping Method
Express Air
Shipping Time
Nov 11 15:36

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This production record covers 50 pieces of 4-layer rigid-flex PCB, each measuring 28 × 18.5 mm and built to a total thickness of 0.3 mm. The design required 3/3 mil trace and spacing, 0.1 mm minimum hole size, blind vias, and 1 oz copper on all layers. These features, combined with the thin cross-section, called for precise material preparation, inner layer imaging, and controlled etching to maintain registration and electrical integrity throughout the rigid and flex zones.

 

Layer stack alignment was followed by flex-rigid lamination under high pressure to ensure reliable bonding at the transition areas. Black soldermask and white silkscreen were applied prior to electroless nickel deposition and immersion gold plating, producing a uniform ENIG surface finish. Controlled depth routing then defined the final outline while protecting the flexible sections.

 

Dynamic flex reliability testing and 100 % electrical testing verified performance under repeated bending and confirmed impedance stability. The 5-day manufacturing cycle allowed careful validation at each critical step, resulting in consistent quality across the full lot and meeting the mechanical and electrical demands of this thin rigid-flex configuration.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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