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4 Layer Rigid-Flex PCB Production Record #RFP-20241114-0095

Start Rigid-Flex PCB Quote

PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 10 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 500 x 128 mm Copper Weight 1OZ
Thickness 0.6 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen None

Manufacturing Timeline

Order Created
Sep 30 17:11
Files Ready
Sep 30 17:11
Engineering Review Completed
Sep 30 17:20
Payment down
Oct 19 14:28
Production Started
Oct 19 14:30
Production Completed
Nov 14 16:36
Progress: 0/6
Engineering Review time: 10 min
Production time: 26.1d

Logistics Information

Production Completed→Shipping : 3 min
Carrier
DHL
Destination
BULGARIA
Shipping Method
Express Air
Shipping Time
Nov 14 16:38

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This 4-layer rigid-flex PCB order consisted of 10 boards with dimensions of 500 × 128 mm and a finished thickness of just 0.6 mm. The stack used 1 oz copper throughout, 4/4 mil trace width and spacing, 0.2 mm minimum holes, green soldermask, and immersion gold ENIG finish. These parameters required precise material selection and registration control during flex-rigid lamination to prevent stress concentrations at the transition zones while preserving the thin cross-section.

 

Production followed a sequence of inner layer imaging, circuit etching, high-pressure lamination, and controlled-depth routing to create clean flex contours without compromising the rigid sections. Dynamic flex reliability testing was performed after electroless nickel and immersion gold deposition to validate bend endurance specific to this elongated form factor. The absence of silkscreen simplified the solder mask process yet still demanded uniform coverage across both material types.

 

All boards passed electrical testing after 26.1 days of fabrication, confirming consistent interconnect integrity and plating quality. The executed process steps delivered reliable rigid-flex performance tailored to the tight geometries and thin profile of this build.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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