Coupons
Help
  • FAQ
    browse most common questions
  • Live Chat
    talk with our online service
  • Email
    contact your dedicated sales:

4 Layer Rigid-Flex PCB Production Record #RFP-20241122-0080

Start Rigid-Flex PCB Quote

PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 20 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 24.6 x 105 mm Copper Weight 1OZ
Thickness 1 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.25mm
Solder Mask Black Silkscreen White

Manufacturing Timeline

Order Created
Nov 01 19:11
Files Ready
Nov 01 20:02
Engineering Review Completed
Nov 01 21:48
Payment down
Nov 05 15:39
Production Started
Nov 07 17:51
Production Completed
Nov 22 16:58
Progress: 0/6
Engineering Review time: 0.8 h Multiple File Revisions
Production time: 15.0d

Logistics Information

Production Completed→Shipping : 3 min
Carrier
DHL
Destination
CZECH REPUBLIC, THE
Shipping Method
Express Air
Shipping Time
Nov 22 17:01

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This 4-layer rigid-flex PCB production consisted of 20 panels, each 24.6 x 105 mm in dimension and 1 mm in thickness. Built with 1 oz copper layers and adhering to 6/6 mil minimum track and spacing rules, the boards featured 0.25 mm holes, black soldermask, white silkscreen printing, and an immersion gold ENIG finish. The rigid-flex configuration necessitated specialized flex-rigid lamination and controlled depth routing to properly define the flexible areas.

 

Following detailed engineering review and material preparation, the inner layers underwent imaging and etching prior to stack alignment and high-pressure lamination. Solder mask was applied after the lamination steps, succeeded by electroless nickel deposition and immersion gold plating. Dynamic flex reliability testing played a critical role in confirming the mechanical endurance of the flex sections.

 

Electrical testing at the end of the 15-day manufacturing cycle ensured full functionality. The executed processes resulted in panels that meet the required consistency for applications involving both rigid stability and dynamic flexing.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

2026 AIVON.COM All Rights Reserved
Intellectual Property Rights | Terms of Service | Privacy Policy | Refund Policy