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4 Layer Rigid-Flex PCB Production Record #RFP-20241202-0028

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 250 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 8 x 31.7 mm Copper Weight 1OZ
Thickness 0.4 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Nov 13 17:11
Files Ready
Nov 13 17:11
Engineering Review Completed
Nov 13 17:22
Payment down
Nov 13 17:11
Production Started
Nov 14 09:45
Production Completed
Dec 02 14:55
Progress: 0/6
Engineering Review time: 0.2 h
Production time: 18.3d

Logistics Information

Production Completed→Shipping : 4 min
Carrier
DHL
Destination
KOREA, REPUBLIC OF (SOUTH K.)
Shipping Method
Express Air
Shipping Time
Dec 02 14:58

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Panelization Optimization
14
Batch AOI Inspection
15
Yield Control Management
16
Electrical Testing

Manufacturing Summary

This order comprised 250 units of 4-layer rigid-flex PCBs measuring 8 × 31.7 mm and only 0.4 mm thick. With 4/4 mil trace width and spacing, 0.2 mm minimum holes, green soldermask, white silkscreen, and immersion gold ENIG finish on 1 oz copper, the tighter geometries on a thin rigid-flex construction required precise process controls during imaging, etching, and layer stack alignment to preserve registration across material transitions.

 

Manufacturing followed a disciplined sequence of flex-rigid lamination, solder mask application, electroless nickel and immersion gold deposition, controlled depth routing, and dynamic flex reliability testing. These steps ensured the boards could endure repeated bending without compromising circuit integrity. Batch AOI inspection and full electrical testing confirmed consistent results across the entire run.

 

The complete cycle from engineering review through final verification took 18.3 days, yielding reliable rigid-flex boards that fully satisfied the dimensional, electrical, and mechanical requirements of the design.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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