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4 Layer Rigid-Flex PCB Production Record #RFP-20241210-0016

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 50 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 32.1 x 101.8 mm Copper Weight 1OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Matte Black Silkscreen White

Manufacturing Timeline

Order Created
Sep 30 17:51
Files Ready
Sep 30 17:51
Engineering Review Completed
Sep 30 18:04
Payment down
Oct 12 07:20
Production Started
Oct 14 17:59
Production Completed
Nov 07 17:41
Progress: 0/6
Engineering Review time: 0.3 h
Production time: 24.0d

Logistics Information

Production Completed→Shipping : 2.7d
Carrier
DHL
Destination
CANADA
Shipping Method
Express Air
Shipping Time
Dec 10 09:45

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

For this rigid-flex PCB production run, we manufactured 50 boards in a 4-layer configuration measuring 32.1 x 101.8 mm with a finished thickness of 1.6 mm. The design utilized 1 oz copper layers and maintained standard 6/6 mil track and spacing along with 0.3 mm minimum hole sizes. Manufacturing began with thorough engineering review and material preparation, followed by precise circuit imaging, etching, and layer stack alignment to accommodate the hybrid rigid and flex requirements.

 

Flex-rigid lamination formed the core of the process, ensuring strong bonding between sections. After solder mask application in matte black and white silkscreen, the boards received an immersion gold ENIG surface finish through electroless nickel and immersion gold deposition. Controlled depth routing was applied to achieve accurate outlines while protecting flexible areas.

 

Dynamic flex reliability testing verified long-term performance under repeated bending cycles essential for this rigid-flex design. Final electrical testing demonstrated consistent results across the full batch, confirming that every board met the specified parameters for quality and durability in its intended application.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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