Coupons
Help
  • FAQ
    browse most common questions
  • Live Chat
    talk with our online service
  • Email
    contact your dedicated sales:

4 Layer Rigid-Flex PCB Production Record #RFP-20250117-0055

Start Rigid-Flex PCB Quote

PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 5 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 214 x 191.5 mm Copper Weight 1OZ
Thickness 1 mm Min Track / Spacing 5/5mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.25mm
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Dec 31 17:17
Files Ready
Dec 31 17:17
Engineering Review Completed
Jan 07 10:19
Payment down
Jan 07 10:19
Production Started
Jan 07 10:19
Production Completed
Jan 17 14:18
Progress: 0/6
Engineering Review time: 7d
Production time: 10.2d

Logistics Information

Production Completed→Shipping : 9 min
Carrier
DHL
Destination
UNITED ARAB EMIRATES
Shipping Method
Express Air
Shipping Time
Jan 17 14:27

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This 4-layer rigid-flex PCB order consisted of five panels measuring 214 × 191.5 mm with a finished board thickness of 1.0 mm. The stack used 1 oz copper throughout and required 5/5 mil trace width and spacing, paired with 0.25 mm minimum holes. Immersion gold ENIG surface finish was applied over green soldermask and white silkscreen, providing both corrosion resistance and reliable solderability for the mixed rigid and flexible zones.

 

Execution centered on precise layer stack alignment followed by high-pressure and flex-rigid lamination steps to maintain registration across material transitions. After solder mask application, electroless nickel and immersion gold deposition were tightly controlled. Controlled depth routing accurately defined the flexible areas, while dynamic flex reliability testing subjected the panels to repeated bend cycles before final electrical testing confirmed continuity and isolation on every board.

 

The complete process took 10.2 days and produced panels that met all mechanical and electrical criteria without deviation. The tighter geometry and specialized lamination approach ensured consistent performance suited to compact assemblies that demand both structural stability and flex capability.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

2026 AIVON.COM All Rights Reserved
Intellectual Property Rights | Terms of Service | Privacy Policy | Refund Policy