Coupons
Help
  • FAQ
    browse most common questions
  • Live Chat
    talk with our online service
  • Email
    contact your dedicated sales:

4 Layer Rigid-Flex PCB Production Record #RFP-20250222-0118

Start Rigid-Flex PCB Quote

PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 50 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 114 x 24 mm Copper Weight 2OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Feb 05 09:09
Files Ready
Feb 05 09:09
Engineering Review Completed
Feb 05 10:09
Payment down
Feb 05 18:11
Production Started
Feb 05 18:15
Production Completed
Feb 22 18:33
Progress: 0/6
Engineering Review time: 1h Multiple File Revisions
Production time: 17.1d

Logistics Information

Production Completed→Shipping : 2 min
Carrier
FedEx IP
Destination
SWITZERLAND
Shipping Method
Express Air
Shipping Time
Feb 22 18:35

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Thick Copper Electroplating
09
Controlled Copper Etching
10
Solder Mask Application
11
Electroless Nickel Deposition
12
Immersion Gold Deposition
13
Controlled Depth Routing
14
Dynamic Flex Reliability Testing
15
Electrical Testing

Manufacturing Summary

This production record covers 50 pieces of 4-layer rigid-flex PCB, each measuring 114 x 24 mm with a board thickness of 1.6 mm and 2 oz copper on all layers. Manufacturing involved standard 6/6 mil trace and spacing together with 0.3 mm minimum holes. The surface was finished with immersion gold ENIG over green soldermask and white silkscreen, requiring exact registration between rigid FR4 sections and flexible zones to maintain mechanical integrity without blind vias.

 

The sequence began with engineering review and material preparation, followed by inner layer imaging, circuit etching, high-pressure lamination, and flex-rigid lamination. We applied thick copper electroplating and controlled etching to accommodate the heavier copper weight, then performed solder mask application, electroless nickel deposition, and immersion gold deposition. Dynamic flex reliability testing verified the transition areas could endure repeated bending.

 

Controlled depth routing prepared the final outlines before 100% electrical testing confirmed continuity and isolation across the full batch. The 17.1-day schedule delivered consistent plating thickness and layer alignment, meeting all specified requirements for this rigid-flex order.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

2026 AIVON.COM All Rights Reserved
Intellectual Property Rights | Terms of Service | Privacy Policy | Refund Policy