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4 Layer Rigid-Flex PCB Production Record #RFP-20250304-0032

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 5 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 102 x 193 mm Copper Weight 1OZ
Thickness 1.6 mm Min Track / Spacing 5/5mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Black Silkscreen White

Manufacturing Timeline

Order Created
Jan 22 08:55
Files Ready
Jan 22 08:55
Engineering Review Completed
Jan 22 09:30
Payment down
Jan 24 20:28
Production Started
Jan 24 20:29
Production Completed
Feb 04 13:54
Progress: 0/6
Engineering Review time: 0.6 h
Production time: 8.8d

Logistics Information

Production Completed→Shipping : 9 min
Carrier
FedEx IP
Destination
UNITED KINGDOM
Shipping Method
Express Air
Shipping Time
Mar 04 14:02

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This order comprised five 4-layer rigid-flex PCBs, each 102 × 193 mm and 1.6 mm thick, built on 1 oz copper with 5/5 mil minimum trace and spacing. The tighter geometry required exact inner layer imaging and etching to maintain trace integrity across both rigid and flexible zones. Black soldermask, white silkscreen, and immersion gold ENIG surface finish were applied, providing good contrast and reliable contact surfaces without nickel over-etching.

 

Manufacturing followed a disciplined sequence of flex-rigid lamination, high-pressure bonding, and controlled depth routing to protect the polyimide flex areas. Dynamic flex reliability testing was performed on each board to confirm bend endurance at the transition zones, followed by 100 % electrical testing. The 8.8-day schedule accommodated the multiple lamination cycles and iterative verification required for this hybrid construction.

 

All five boards were delivered within specification, demonstrating consistent layer registration and solderability. The combination of rigid-flex technology, ENIG plating, and verified flex endurance produced parts ready for direct integration into the end application.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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