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4 Layer Rigid-Flex PCB Production Record #RFP-20250515-0034

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 110 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 37.2 x 4 mm Copper Weight 1OZ
Thickness 0.4 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Apr 23 18:07
Files Ready
Apr 23 18:07
Engineering Review Completed
Apr 23 18:36
Payment down
Apr 25 09:50
Production Started
Apr 25 09:52
Production Completed
May 14 16:16
Progress: 0/6
Engineering Review time: 0.5 h
Production time: 19.3d

Logistics Information

Production Completed→Shipping : 0.8d
Carrier
DHL
Destination
KOREA, REPUBLIC OF (SOUTH K.)
Shipping Method
Express Air
Shipping Time
May 15 10:39

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This order involved the production of 110 units of 4-layer rigid-flex PCBs, each measuring 37.2 × 4 mm with an overall thickness of 0.4 mm. The combination of thin profile, 1 oz copper layers, and 4/4 mil minimum trace width and spacing required precise inner layer imaging, circuit etching, and layer stack alignment to maintain signal integrity across rigid-to-flex transitions while meeting the 0.2 mm minimum hole size.

 

High-pressure lamination and dedicated flex-rigid lamination steps ensured reliable material bonding for the single-board construction. Green soldermask with white silkscreen was applied, followed by immersion gold ENIG surface finish. Controlled depth routing created precise outlines that preserved the flexible zones required for the end application.

 

Dynamic flex reliability testing validated bending endurance, supported by full electrical testing that confirmed net continuity and isolation. The complete sequence, executed over 19.3 days, produced consistent boards with stable layer registration and dependable performance in a compact rigid-flex format.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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