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4 Layer Rigid-Flex PCB Production Record #RFP-20250517-0053

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 10 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 129 x 56 mm Copper Weight 1OZ
Thickness 1 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Mar 24 17:57
Files Ready
Mar 24 17:57
Engineering Review Completed
Mar 24 18:34
Payment down
Apr 02 17:02
Production Started
Apr 14 17:17
Production Completed
May 06 18:01
Progress: 0/6
Engineering Review time: 0.7 h
Production time: 22.1d

Logistics Information

Production Completed→Shipping : 11.1d
Carrier
DHL
Destination
SINGAPORE
Shipping Method
Express Air
Shipping Time
May 17 18:20

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Flex-Rigid Lamination
10
Solder Mask Application
11
Electroless Nickel Deposition
12
Immersion Gold Deposition
13
Controlled Depth Routing
14
TDR Impedance Testing
15
Dynamic Flex Reliability Testing
16
Electrical Testing

Manufacturing Summary

This 4-layer rigid-flex PCB was built as a set of 10 single boards measuring 129 × 56 mm with 1.0 mm finished thickness and 1 oz copper. The design used standard 6/6 mil trace and spacing, 0.3 mm minimum holes, green soldermask, white silkscreen, and immersion gold ENIG finish. These parameters required careful material selection and process sequencing to integrate the rigid FR4 sections with the flexible areas while preserving dimensional stability.

 

Engineering review and stackup impedance engineering were completed first, followed by trace width compensation, inner layer imaging, and precise circuit etching. Flex-rigid lamination and high-pressure bonding steps received particular attention to ensure clean transitions without delamination risk. After solder mask application, electroless nickel and immersion gold deposition were performed, then controlled depth routing defined the final outline.

 

Each board underwent TDR impedance testing, dynamic flex reliability testing, and 100 % electrical testing to confirm both electrical performance of the impedance controlled PCB and mechanical endurance of the flex zones. The complete order moved through all process stages in 22.1 days and was delivered with consistent quality matching the specified requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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