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4 Layer Rigid-Flex PCB Production Record #RFP-20250710-0057

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 400 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 216 x 184.5 mm Copper Weight 1OZ
Thickness 1 mm Min Track / Spacing 5/5mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Blue Silkscreen White

Manufacturing Timeline

Order Created
May 22 18:01
Files Ready
May 22 18:01
Engineering Review Completed
May 22 18:11
Payment down
May 22 18:11
Production Started
May 22 18:11
Production Completed
Jun 10 15:51
Progress: 0/6
Engineering Review time: 9 min
Production time: 19.0d

Logistics Information

Production Completed→Shipping : 3 min
Carrier
DHL
Destination
GERMANY
Shipping Method
Express Air
Shipping Time
Jul 10 15:54

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Panelization Optimization
14
Batch AOI Inspection
15
Yield Control Management
16
Electrical Testing

Manufacturing Summary

This order consisted of 400 panels of 4-layer rigid-flex PCB, each measuring 216 x 184.5 mm with 1.0 mm overall thickness. The design featured 5/5 mil trace width and spacing, 1oz copper weight, 0.2 mm minimum hole size, blue soldermask, and white silkscreen. Immersion gold ENIG surface finish was selected to ensure reliable soldering and long-term contact integrity on the hybrid rigid-flex structure.

 

Execution required precise layer stack alignment and flex-rigid lamination to integrate the flexible sections without inducing stress or misalignment. Controlled depth routing was employed to separate individual boards from the panel while preserving the flex areas. Dynamic flex reliability testing formed a critical part of the process, verifying the panels' ability to endure repeated flexing.

 

Batch AOI inspection, electrical testing, and yield control measures ensured all 400 panels met the required specifications. The manufacturing sequence, spanning material preparation through final testing, delivered consistent results suited for applications demanding both mechanical flexibility and electronic reliability.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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