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4 Layer Rigid-Flex PCB Production Record #RFP-20250718-0080

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 20 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 106 x 295.5 mm Copper Weight 2OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen None

Manufacturing Timeline

Order Created
Jun 12 17:59
Files Ready
Jun 12 17:59
Engineering Review Completed
Jun 12 18:05
Payment down
Jun 13 17:47
Production Started
Jun 18 18:44
Production Completed
Jul 18 14:02
Progress: 0/6
Engineering Review time: 7 min
Production time: 29.9d

Logistics Information

Production Completed→Shipping : 0.4 h
Carrier
DHL
Destination
GERMANY
Shipping Method
Express Air
Shipping Time
Jul 18 14:22

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Thick Copper Electroplating
09
Controlled Copper Etching
10
Solder Mask Application
11
Electroless Nickel Deposition
12
Immersion Gold Deposition
13
Controlled Depth Routing
14
Dynamic Flex Reliability Testing
15
Electrical Testing

Manufacturing Summary

This order comprised 20 panels of 4-layer rigid-flex PCB, each measuring 106 × 295.5 mm with 1.6 mm thickness and 2 oz copper weight. The hybrid rigid-flex construction required precise layer stack alignment and flex-rigid lamination to integrate flexible zones without compromising structural stability or introducing stress concentrations. Standard 6/6 mil track spacing and 0.3 mm minimum hole size were maintained throughout, while the heavier copper demanded adjusted etching parameters to preserve trace integrity across both material types.

 

Inner layer imaging and circuit etching were followed by high-pressure lamination and thick copper electroplating to ensure uniform conductor thickness. Green solder mask was applied before electroless nickel deposition and immersion gold deposition to produce a reliable ENIG finish. Controlled depth routing defined the final panel outlines, respecting the transition areas between rigid and flex sections.

 

Dynamic flex reliability testing and full electrical testing verified bend endurance and net continuity across the entire batch. The 29.9-day production cycle allowed measured pacing through material preparation, multiple lamination cycles, and quality checkpoints, resulting in consistent boards delivered to specification for this rigid-flex application.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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