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4 Layer Rigid-Flex PCB Production Record #RFP-20250718-0081

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 20 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 171 x 106 mm Copper Weight 2OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen None

Manufacturing Timeline

Order Created
Jun 12 17:59
Files Ready
Jun 12 17:59
Engineering Review Completed
Jun 12 18:29
Payment down
Jun 13 17:47
Production Started
Jun 18 18:44
Production Completed
Jul 07 11:15
Progress: 0/6
Engineering Review time: 0.6 h
Production time: 18.7d

Logistics Information

Production Completed→Shipping : 11.2d
Carrier
DHL
Destination
GERMANY
Shipping Method
Express Air
Shipping Time
Jul 18 14:22

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Thick Copper Electroplating
09
Controlled Copper Etching
10
Solder Mask Application
11
Electroless Nickel Deposition
12
Immersion Gold Deposition
13
Controlled Depth Routing
14
Dynamic Flex Reliability Testing
15
Electrical Testing

Manufacturing Summary

This production record covers 20 panels of 4-layer rigid-flex PCBs built to 171 × 106 mm dimensions and 1.6 mm finished thickness, using 2 oz copper on all layers. The design followed a conventional 6/6 mil trace and spacing requirement with 0.3 mm minimum holes, green soldermask on rigid zones, and no silkscreen. Immersion gold ENIG was selected as the surface finish to support reliable contact points in both rigid and flex areas.

 

Execution centered on accurate flex-rigid lamination after high-pressure bonding of the flexible polyimide layers to FR4 sections. Thick copper electroplating established the 2 oz weight, followed by controlled etching, solder mask application, electroless nickel deposition, and immersion gold plating. Controlled depth routing produced clean panel outlines while preserving flex transition zones.

 

Dynamic flex reliability testing and 100 % electrical testing confirmed mechanical endurance and circuit continuity across all panels. The 18.7-day schedule delivered consistent registration and quality that matched the rigid-flex requirements without deviation.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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