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4 Layer Rigid-Flex PCB Production Record #RFP-20250718-0082

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 20 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 406 x 191 mm Copper Weight 2OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen None

Manufacturing Timeline

Order Created
Jun 12 17:59
Files Ready
Jun 12 17:59
Engineering Review Completed
Jun 12 18:31
Payment down
Jun 13 17:47
Production Started
Jun 18 18:44
Production Completed
Jul 18 14:01
Progress: 0/6
Engineering Review time: 0.6 h
Production time: 29.9d

Logistics Information

Production Completed→Shipping : 0.4 h
Carrier
DHL
Destination
GERMANY
Shipping Method
Express Air
Shipping Time
Jul 18 14:22

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Thick Copper Electroplating
09
Controlled Copper Etching
10
Solder Mask Application
11
Electroless Nickel Deposition
12
Immersion Gold Deposition
13
Controlled Depth Routing
14
Dynamic Flex Reliability Testing
15
Electrical Testing

Manufacturing Summary

This production record covers 20 panels of 4-layer rigid-flex PCB, each measuring 406 × 191 mm and finished at 1.6 mm thickness with 2 oz copper throughout. The hybrid construction demanded accurate layer stack alignment and dedicated flex-rigid lamination steps to secure reliable transitions between rigid FR4 sections and flexible zones while preserving circuit continuity. Standard 6/6 mil trace and spacing was maintained, with 0.3 mm minimum hole size, allowing conventional imaging and etching processes to deliver consistent results across the batch.

 

Green soldermask and immersion gold ENIG surface finish were applied after solder mask processing, omitting silkscreen per specification. Controlled depth routing prepared the final panel outline, after which dynamic flex reliability testing validated mechanical endurance under repeated bending. Full electrical testing confirmed isolation and continuity on every panel before release. The 29.9-day schedule accommodated thorough verification at each stage from material preparation through final inspection, resulting in uniform quality suited to the rigid-flex design.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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