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4 Layer Rigid-Flex PCB Production Record #RFP-20250718-0083

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 20 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 186 x 111.6 mm Copper Weight 2OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen None

Manufacturing Timeline

Order Created
Jun 12 17:59
Files Ready
Jun 12 17:59
Engineering Review Completed
Jun 12 18:41
Payment down
Jun 13 17:47
Production Started
Jun 18 18:44
Production Completed
Jul 07 11:15
Progress: 0/6
Engineering Review time: 0.8 h
Production time: 18.7d

Logistics Information

Production Completed→Shipping : 11.2d
Carrier
DHL
Destination
GERMANY
Shipping Method
Express Air
Shipping Time
Jul 18 14:22

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Thick Copper Electroplating
09
Controlled Copper Etching
10
Solder Mask Application
11
Electroless Nickel Deposition
12
Immersion Gold Deposition
13
Controlled Depth Routing
14
Dynamic Flex Reliability Testing
15
Electrical Testing

Manufacturing Summary

This 4-layer rigid-flex PCB order comprised 20 panels sized 186 × 111.6 mm at 1.6 mm thickness with 2 oz copper throughout. The design used standard 6/6 mil trace and spacing, 0.3 mm minimum holes, green solder mask, and immersion gold ENIG finish without silkscreen. Material preparation and inner layer imaging established accurate flex and rigid zones, after which we performed flex-rigid lamination and high pressure lamination to integrate the dissimilar sections reliably.

 

Thick copper electroplating and controlled copper etching maintained uniform 2 oz weight while preserving trace profiles. Layer stack alignment was verified at each stage to avoid registration errors typical of rigid-flex constructions. Solder mask application, electroless nickel deposition, and immersion gold deposition followed, delivering a clean, oxidation-resistant surface suited to the board's mixed mechanical demands.

 

Controlled depth routing prepared precise outlines, and dynamic flex reliability testing confirmed the panels endured repeated bending cycles without delamination or conductor fracture. Full electrical testing completed the 18.7-day schedule, yielding consistent performance across the full lot and meeting all dimensional and functional requirements for this rigid-flex PCB.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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