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4 Layer Rigid-Flex PCB Production Record #RFP-20250718-0084

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 20 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 225 x 137 mm Copper Weight 2OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen None

Manufacturing Timeline

Order Created
Jun 12 17:59
Files Ready
Jun 12 17:59
Engineering Review Completed
Jun 12 18:47
Payment down
Jun 13 17:47
Production Started
Jun 18 18:44
Production Completed
Jul 07 11:14
Progress: 0/6
Engineering Review time: 0.9 h
Production time: 18.7d

Logistics Information

Production Completed→Shipping : 11.2d
Carrier
DHL
Destination
GERMANY
Shipping Method
Express Air
Shipping Time
Jul 18 14:22

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Thick Copper Electroplating
09
Controlled Copper Etching
10
Solder Mask Application
11
Electroless Nickel Deposition
12
Immersion Gold Deposition
13
Controlled Depth Routing
14
Dynamic Flex Reliability Testing
15
Electrical Testing

Manufacturing Summary

This production record covers 20 panels of 4-layer rigid-flex PCBs measuring 225 × 137 mm with 1.6 mm finished thickness and 2 oz copper on all layers. The design used standard 6/6 mil trace and spacing, 0.3 mm minimum holes, green soldermask, and no silkscreen. Immersion gold ENIG was selected for the surface finish to provide stable contact resistance and long-term protection on both rigid and flex transition zones.

 

We performed flex-rigid lamination after high-pressure rigid stack-up to ensure accurate alignment between flexible polyimide layers and FR4 sections. Controlled depth routing defined the exact bend areas while thick copper electroplating and subsequent etching maintained uniform 2 oz conductors. Dynamic flex reliability testing was conducted on sample panels to confirm the construction would withstand repeated bending without delamination or trace fracture.

 

Layer stack alignment, electroless nickel deposition, and final electrical testing were completed sequentially, resulting in consistent interlayer registration and impedance stability across the full quantity. The entire order from engineering review to shipment was executed in 18.7 days.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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