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4 Layer Rigid-Flex PCB Production Record #RFP-20250901-0052

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 30 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 19 x 99 mm Copper Weight 1OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Aug 14 14:00
Files Ready
Engineering Review Completed
Payment down
Aug 14 14:00
Production Started
Aug 14 15:46
Production Completed
Sep 01 14:08
Progress: 0/6
Production time: 18.0d

Logistics Information

Production Completed→Shipping : 9 min
Carrier
DHL
Destination
POLAND
Shipping Method
Express Air
Shipping Time
Sep 01 14:17

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This production run delivered 30 panels of 4-layer rigid-flex PCB, each measuring 19 × 99 mm with 1.6 mm overall thickness and 1 oz copper weight. The stack used green soldermask, white silkscreen, immersion gold ENIG finish, 0.2 mm minimum holes, and conventional 6/6 mil track spacing. Because the design combined rigid sections with flexible circuits in panel format, particular care was given to material preparation, layer stack alignment, and the transition zones to prevent delamination or stress concentrations during bending.

 

High pressure lamination and flex-rigid lamination bonded the dissimilar materials reliably before controlled depth routing defined the flex areas. Dynamic flex reliability testing subjected sample circuits to repeated bend cycles, verifying mechanical endurance. Solder mask application, electroless nickel deposition, and immersion gold deposition were sequenced to maintain uniform coverage across both rigid and flex surfaces.

 

Electrical testing confirmed full continuity and isolation on every panel. The complete sequence from engineering review through final verification took 18 days and produced consistent results that met all specified requirements for these rigid-flex boards.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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