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4 Layer Rigid-Flex PCB Production Record #RFP-20250911-0085

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 20 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 199 x 411 mm Copper Weight 2OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen None

Manufacturing Timeline

Order Created
Aug 15 16:10
Files Ready
Aug 15 16:10
Engineering Review Completed
Aug 15 18:17
Payment down
Aug 15 18:17
Production Started
Aug 15 18:18
Production Completed
Sep 11 13:46
Progress: 0/6
Engineering Review time: 2 h
Production time: 26.9d

Logistics Information

Production Completed→Shipping : 3.8 h
Carrier
FedEx IP
Destination
GERMANY
Shipping Method
Express Air
Shipping Time
Sep 11 17:32

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Thick Copper Electroplating
09
Controlled Copper Etching
10
Solder Mask Application
11
Electroless Nickel Deposition
12
Immersion Gold Deposition
13
Controlled Depth Routing
14
Dynamic Flex Reliability Testing
15
Electrical Testing

Manufacturing Summary

This order involved manufacturing 20 panels of 4-layer rigid-flex PCBs, each measuring 199 × 411 mm with 1.6 mm thickness and 2 oz copper weight. The design followed standard 6/6 mil trace and spacing rules, with green solder mask and ENIG immersion gold finish but no silkscreen. The rigid-flex construction required exact material selection for both FR4 and polyimide sections, along with precise layer stack alignment to maintain reliable transitions between rigid and flex zones during flex-rigid lamination.

 

High-pressure lamination secured the stack, after which thick copper electroplating and controlled etching produced uniform 2 oz conductors. Solder mask application preceded electroless nickel and immersion gold deposition. Controlled depth routing created clean panel outlines while preserving flexible areas. Dynamic flex reliability testing was performed to confirm the panels could endure repeated bending without delamination or trace damage.

 

Electrical testing verified continuity and isolation across all 20 panels. The 26.9-day production schedule accommodated the additional steps inherent to rigid-flex fabrication, ensuring every board met dimensional and performance requirements with consistent quality.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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