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4 Layer Rigid-Flex PCB Production Record #RFP-20250923-0057

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 5 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 320 x 14.5 mm Copper Weight 1OZ
Thickness 0.8 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Aug 29 16:55
Files Ready
Aug 29 16:55
Engineering Review Completed
Aug 29 19:35
Payment down
Sep 02 15:41
Production Started
Sep 02 15:41
Production Completed
Sep 23 14:31
Progress: 0/6
Engineering Review time: 2.6 h
Production time: 21.0d

Logistics Information

Production Completed→Shipping : 3.4 h
Carrier
DHL
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Sep 23 17:51

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

Five 4-layer rigid-flex PCBs were manufactured to the dimensions 320 × 14.5 mm and 0.8 mm finished thickness. The narrow aspect ratio and hybrid construction required exacting material preparation and flex-rigid lamination to align the polyimide flex layers with the FR-4 rigid sections while preserving mechanical integrity. 1 oz copper, 6/6 mil trace spacing, and 0.3 mm minimum holes were maintained throughout using standard geometry processes.

 

Green soldermask and white silkscreen were applied prior to electroless nickel and immersion gold deposition, yielding a uniform ENIG surface finish. Controlled depth routing isolated the rigid and flex zones without compromising the thin stack. Dynamic flex reliability testing was executed on the completed boards to confirm endurance under repeated bending cycles.

 

Full electrical testing verified net continuity and isolation. The 21-day production schedule accommodated the specialized lamination, routing, and validation steps, resulting in five consistent rigid-flex boards delivered for integration into compact electronic systems.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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