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4 Layer Rigid-Flex PCB Production Record #RFP-20251014-0099

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 15 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 103.7 x 131.2 mm Copper Weight 1OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.25mm
Solder Mask Black Silkscreen White

Manufacturing Timeline

Order Created
Sep 19 18:35
Files Ready
Sep 19 18:35
Engineering Review Completed
Sep 30 10:12
Payment down
Sep 30 10:12
Production Started
Sep 30 10:12
Production Completed
Oct 11 15:12
Progress: 0/6
Engineering Review time: 10.9 d
Production time: 11.3d

Logistics Information

Production Completed→Shipping : 2.4d
Carrier
FedEx IP
Destination
UNITED KINGDOM
Shipping Method
Express Air
Shipping Time
Oct 14 00:08

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

Manufacturing of this batch comprised 15 pieces of 4-layer rigid-flex PCBs, each measuring 103.7 x 131.2 mm with 1.6 mm thickness and 1 oz copper weight. The boards featured a conventional 6/6 mil trace spacing and 0.25 mm minimum hole size. Production emphasized the specialized flex-rigid lamination process to seamlessly combine the rigid FR4 sections with flexible areas, all while maintaining proper layer alignment throughout.

 

Black solder mask and white silkscreen were applied prior to the immersion gold ENIG surface finish, ensuring excellent solderability and corrosion resistance. Controlled depth routing was utilized to define the panel outlines accurately, protecting the flexible zones during separation.

 

Following assembly of the layers, we conducted dynamic flex reliability testing along with 100% electrical testing to validate performance under bending stress and confirm circuit integrity. The complete manufacturing cycle, incorporating all key processes from material preparation to final verification, spanned 11.3 days and yielded consistent, reliable rigid-flex boards meeting the customer's exact specifications.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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