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4 Layer Rigid-Flex PCB Production Record #RFP-20251027-0215

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 10 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 85.65 x 305.4 mm Copper Weight 1OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Oct 08 16:51
Files Ready
Oct 08 17:06
Engineering Review Completed
Oct 08 18:17
Payment down
Oct 08 20:53
Production Started
Oct 08 20:57
Production Completed
Oct 24 15:22
Progress: 0/6
Engineering Review time: 0.8 h Multiple File Revisions
Production time: 15.8d

Logistics Information

Production Completed→Shipping : 3.3d
Carrier
UPS
Destination
FRANCE
Shipping Method
Express Air
Shipping Time
Oct 27 21:55

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

These ten 4-layer rigid-flex panels, each measuring 85.65 × 305.4 mm at 1.6 mm thickness, required precise integration of rigid FR4 sections with flexible zones. Using 1 oz copper and 6/6 mil geometry, the boards featured 0.3 mm minimum holes, green soldermask, and white silkscreen. Production followed a dedicated flex-rigid lamination sequence after careful layer stack alignment and high-pressure pressing to maintain registration across the long, narrow panels.

 

Controlled depth routing accurately defined the flex-to-rigid transitions while avoiding damage to inner layers. The immersion gold ENIG finish was applied through electroless nickel deposition followed by immersion gold, providing uniform coverage and oxidation resistance. Dynamic flex reliability testing was performed to confirm the panels could endure repeated bending without trace fracture or delamination.

 

Electrical testing of all boards showed full continuity and isolation within specification. The 15.8-day schedule allowed thorough process control at each stage, delivering consistent rigid-flex PCBs suited for applications that combine mechanical flexibility with stable mounting areas.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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