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4 Layer Rigid-Flex PCB Production Record #RFP-20251110-0038

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 10 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 501 x 137 mm Copper Weight 1OZ
Thickness 0.6 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen None

Manufacturing Timeline

Order Created
Sep 19 01:13
Files Ready
Sep 19 01:13
Engineering Review Completed
Sep 19 18:21
Payment down
Sep 19 18:21
Production Started
Sep 19 18:21
Production Completed
Oct 10 13:58
Progress: 0/6
Engineering Review time: 0.7d
Production time: 21.9d

Logistics Information

Production Completed→Shipping : 2 min
Carrier
DHL
Destination
BULGARIA
Shipping Method
Express Air
Shipping Time
Nov 10 13:59

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This order comprised ten 4-layer rigid-flex PCBs produced in panel format, each measuring 501 × 137 mm with a thin 0.6 mm finished thickness and 1 oz copper. The design specified 4/4 mil trace and spacing, 0.2 mm minimum hole size, green soldermask, and immersion gold ENIG finish without silkscreen. These parameters required precise substrate selection for the rigid-to-flex transitions and exacting layer stack alignment to preserve both mechanical flexibility and dimensional stability across the elongated panels.

 

Manufacturing followed a sequence of inner layer imaging, circuit etching, flex-rigid lamination, and high-pressure bonding. Controlled depth routing created clean zone separations while dynamic flex reliability testing confirmed endurance under repeated bending cycles. Full electrical testing verified net continuity on every panel. The 21.9-day schedule accommodated the additional validation steps demanded by the tight geometry and hybrid construction.

 

Execution delivered panels meeting all specified tolerances, with consistent solderability from the immersion gold ENIG and reliable flex performance validated through the testing protocol.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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