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4 Layer Rigid-Flex PCB Production Record #RFP-20251203-0041

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 15 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 47.45 x 69.86 mm Copper Weight 1OZ
Thickness 1.2 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.25mm
Solder Mask Matte Black Silkscreen White

Manufacturing Timeline

Order Created
Nov 04 10:42
Files Ready
Nov 04 10:42
Engineering Review Completed
Nov 04 16:59
Payment down
Nov 04 16:59
Production Started
Nov 04 16:59
Production Completed
Dec 02 16:21
Progress: 0/6
Engineering Review time: 6 h
Production time: 28.0d

Logistics Information

Production Completed→Shipping : 1.1d
Carrier
DHL
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Dec 03 17:56

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This production record covers 15 four-layer rigid-flex PCBs built to 47.45 × 69.86 mm dimensions and 1.2 mm finished thickness. With 4/4 mil minimum trace and spacing on 1 oz copper, the circuit geometry demanded exact inner-layer imaging and etching to preserve signal integrity across both rigid and polyimide flex zones. Material preparation, layer-stack alignment, and flex-rigid lamination were sequenced to prevent delamination while maintaining the required bend radius.

 

Matte black solder mask was applied uniformly before electroless nickel and immersion gold ENIG deposition, delivering a flat, solderable surface without nickel over-etch. Controlled-depth routing accurately defined the rigid-flex transition areas. Dynamic flex reliability testing and full electrical testing confirmed continuity and isolation after 28 days of controlled processing, ensuring every board met the mechanical and electrical criteria before shipment.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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