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4 Layer Rigid-Flex PCB Production Record #RFP-20260326-0002

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 5 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 138 x 215 mm Copper Weight 1OZ
Thickness 0.8 mm Min Track / Spacing 3/3mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Matte Black Silkscreen White

Manufacturing Timeline

Order Created
Dec 05 11:36
Files Ready
Dec 05 11:36
Engineering Review Completed
Dec 12 10:28
Payment down
Dec 12 10:28
Production Started
Dec 12 10:28
Production Completed
Jan 12 11:01
Progress: 0/6
Engineering Review time: 7 d
Production time: 31.1d

Logistics Information

Production Completed→Shipping : 73.0d
Carrier
FedEx IP
Destination
TURKEY
Shipping Method
Express Air
Shipping Time
Mar 26 10:43

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

This order for five panels of 4-layer rigid-flex PCB measured 138 x 215 mm per panel, featuring an overall thickness of 0.8 mm and standard 1 oz copper weight. The specified 3/3 mil track and spacing required heightened precision in the imaging, etching, and layer alignment stages. During flex-rigid lamination, particular attention ensured smooth transitions and reliable bonding without delamination risks on this reduced thickness profile.

 

Following solder mask application in matte black with white silkscreen, the immersion gold ENIG surface finish was deposited to provide superior conductivity and protection. Controlled depth routing prepared the outlines, after which dynamic flex reliability testing and comprehensive electrical testing validated each unit.

 

Completed over a 31-day period, the manufacturing emphasized sequential process validation from material preparation to final inspection. The outcome was a set of consistent, high-reliability rigid-flex circuits that met all dimensional and performance criteria for the customer's application.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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