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OSP Aluminum PCB Production Record #ALU-20240621-0012

Start Aluminum PCB Quote

PCB Specifications

Parameter Value Parameter Value
PCB Type Aluminum PCB Quantity 5 pcs
Layers 1 Layers Board Type Single PCB
Dimensions 18 x 1193.8 mm Copper Weight 1oz
Thickness 1 mm Min Track / Spacing 10/10mil
Surface Finish OSP Min Hole Size 1.5mm↑
Solder Mask White Silkscreen Black
Thermal Conductivity 1.0W Voltage Withstand AC2500V

Manufacturing Timeline

Order Created
Jun 05 02:13
Files Ready
Jun 05 02:13
Engineering Review Completed
Jun 05 02:36
Payment down
Jun 07 00:53
Production Started
Jun 07 00:55
Production Completed
Jun 19 16:00
Progress: 0/6
Engineering Review time: 0.4 h
Production time: 12.7d

Logistics Information

Production Completed→Shipping : 1.4d
Carrier
FedEx IP
Destination
BRAZIL
Shipping Method
Express Air
Shipping Time
Jun 21 00:47

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Metal Base Preparation
04
Circuit Imaging & Etching
05
Thermal Insulation Lamination
06
Solder Mask Application
07
Organic Coating Application
08
Anti-Oxidation Treatment
09
Heat Dissipation Control
10
Electrical Testing

Manufacturing Summary

This aluminum PCB order comprised five single-layer boards measuring 18 × 1193.8 mm on 1.0 mm thick substrate with 1 oz copper and 1.0 W thermal conductivity. The extreme aspect ratio required specific fixtures during metal base preparation and thermal insulation lamination to preserve flatness and avoid distortion along the 1.2-meter length. With a minimum hole size of 1.5 mm and 10/10 mil track spacing, the design followed conventional geometry while the AC2500 V withstand rating added further process controls for dielectric integrity.

 

Circuit imaging and etching were performed on the aluminum core, followed by white solder mask application and black silkscreen printing. OSP surface finish was achieved through organic coating and anti-oxidation treatment to protect the exposed copper without compromising thermal paths. Heat dissipation control steps were integrated after lamination to maintain the material’s specified conductivity across every board.

 

Electrical testing at the end of the 12.7-day production cycle verified voltage withstand and continuity on all five units, confirming consistent performance for linear high-power applications. The completed boards delivered reliable thermal transfer and mechanical stability suited to their elongated format.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
ALU-20260423-0017 Aluminum PCB 1 175 x 732 White HASL Lead Free 5 View detail
ALU-20260322-018 Aluminum PCB 1 276 x 276 White OSP 5 View detail
ALU-20260322-016 Aluminum PCB 1 438.56 x 438.56 White OSP 5 View detail

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