2 Layer Flexible PCB Production Record #FPC-20260322-017

For this order of 2-layer FPCs, we manufactured 230 panels on 0.23 mm thick polyimide using rolled copper. The elongated 620 × 119 mm format, 5/5 mil trace spacing, white soldermask, black silkscreen, and OSP surface finish created a distinct thin-flex profile without stiffeners. These parameters required exact registration during imaging and etching to preserve both electrical performance and mechanical flexibility across the narrow panels.

Polyimide material handling preceded coverlay lamination, followed by solder mask application and anti-oxidation treatment for the OSP coating. We executed dynamic flex testing to confirm circuit integrity under repeated bending, supported by batch AOI inspection and electrical testing at key checkpoints. The 17.9-day production window permitted measured processing at each stage, maintaining dimensional stability on every panel.

Outcome data showed consistent trace definition and surface quality, delivering reliable flexible circuits matched to the order’s tight geometry and thin-substrate requirements.