PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Flexible PCB | Quantity | 50 pcs |
| Layers | 1 Layers | Board Type | Single PCB |
| Dimensions | 121.16 x 12.95 mm | Copper Weight | 1OZ |
| Thickness | 0.11 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | OSP | Min Hole Size | 0.3mm↑ |
| Solder Mask | Yellow | Silkscreen | White |
| Material | Rolled Copper | Stiffener | None |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This order comprised 50 single-layer flexible PCBs fabricated from 0.11 mm polyimide with rolled copper at 1 oz weight. The narrow profile of 121.16 × 12.95 mm, combined with 0.3 mm minimum holes and standard 6/6 mil geometry, demanded precise registration throughout processing. Yellow solder mask and white silkscreen produced a distinct appearance while OSP surface finish maintained full flexibility without added rigidity.
Production began with careful polyimide material handling to protect the thin substrate from creasing. Circuit imaging and etching were followed by coverlay lamination, solder mask application, and organic coating to achieve the OSP finish. Dynamic flex testing verified bending endurance specific to the elongated design, with electrical testing performed on every board to confirm continuity and isolation.
The complete run of 50 flexible PCBs delivered consistent quality over the nine-day schedule. Absence of stiffeners preserved the inherent pliability required by the application, resulting in reliable circuits that met all dimensional and performance criteria.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FPC-20260810-025 | Flexible PCB | 1 | 148.59 x 83.95 | Yellow | OSP | 50 | View detail |
| FPC-20260802-009 | Flexible PCB | 1 | 109 x 214 | None | OSP | 30 | View detail |
| FPC-20260715-044 | Flexible PCB | 1 | 7.65 x 11.44 | None | ENIG (Immersion Gold) | 100 | View detail |