Single Layer Flexible PCB Production Record #FPC-20260810-025

The manufacturing of these 50 single-layer FPCs centered on a thin 0.11 mm substrate using rolled copper material with 1 oz weight. Each board measures 148.59 mm by 83.95 mm and specifies standard 6/6 mil trace and spacing geometry with minimum hole sizes of 0.3 mm. A yellow soldermask paired with white silkscreen was applied over the OSP surface finish on these flexible circuits, providing distinctive coloring and reliable protection without stiffeners.

FPC Material preparation focused on careful polyimide handling to preserve the flexible base during processing. Circuit imaging and etching were executed to the required geometry, followed by coverlay lamination, solder mask application, organic coating, and anti-oxidation treatment to establish the OSP finish. These steps were sequenced to maintain dimensional stability across the thin single PCBs throughout the build.

Dynamic flex testing verified the circuits could endure repeated bending as required for end-use reliability, while electrical testing confirmed continuity and isolation on every board. Completed over a 9-day production window, the order delivered consistent results that matched the specified flexible PCB parameters from initial engineering review to final shipment.