Single Layer Flexible PCB Production Record #FPC-20260802-009

This order comprised 30 single-layer flex PCBs built on 0.13 mm polyimide with rolled copper at 1 oz weight. Boards measured 109 × 214 mm and followed conventional 6/6 mil trace and spacing with 0.3 mm minimum holes. OSP surface finish was applied directly to the exposed copper without soldermask, silkscreen, or stiffeners, preserving the circuit's inherent flexibility.

Material preparation emphasized careful polyimide handling to avoid creasing or contamination on the thin substrate. We performed circuit imaging and etching, followed by precise coverlay lamination and organic coating for the OSP finish. Dynamic flex testing subjected each panel to repeated bend cycles, while full electrical testing verified continuity and isolation across the batch.

Production concluded in 5.8 days with all boards delivered within specification. The combination of rolled copper and minimal thickness required controlled tension throughout lamination and routing stages, resulting in uniform mechanical and electrical performance suited for dynamic applications.