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Single Layer Flexible PCB Production Record #FPC-20260413-058

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PCB Specifications

Parameter Value Parameter Value
PCB Type Flexible PCB Quantity 25 pcs
Layers 1 Layers Board Type Panel PCB
Dimensions 18.5 x 190 mm Copper Weight 1/2OZ
Thickness 0.1 mm Min Track / Spacing 6/6mil↑
Surface Finish Hard gold plating Min Hole Size 0.3mm↑
Solder Mask Yellow Silkscreen White
Material Rolled Copper Stiffener PI Stiffener

Manufacturing Timeline

Order Created
Mar 28 01:00
Files Ready
Mar 28 01:00
Engineering Review Completed
Mar 28 01:30
Payment down
Mar 30 21:34
Production Started
Mar 30 21:37
Production Completed
Apr 13 20:15
Progress: 0/6
Engineering Review time: 0.4 h
Production time: 14.0d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.5 h
Carrier
FedEx IP
Destination
UNITED KINGDOM
Shipping Method
Express Air
Shipping Time
Apr 13 20:40

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Polyimide Material Handling
04
Circuit Imaging & Etching
05
Coverlay Lamination
06
Solder Mask Application
07
Dynamic Flex Testing
08
Electrical Testing

Manufacturing Summary

This single-layer flexible PCB measured 18.5 × 190 mm with a base thickness of 0.1 mm and used rolled copper at 1 oz / ½ oz. Produced as 25 pieces in a 5×1 panel for 5 sets, the order featured hard gold plating (1 µin Au over 120 µin Ni), yellow coverlay on the top side only, and white silkscreen. Two 0.1 mm PI stiffeners were specified. Minimum holes were 0.3 mm with 6 mil line/space, and laser forming completed the outline. The 15-day schedule included full flying-probe testing.

 

DFM review addressed thickness targets and plating details. Because the board was intended for the customer's own SMT process, single-piece shipment was proposed instead of panelized delivery. The original 0.1 mm PI stiffener could not achieve the required 0.3 mm total thickness at the reinforced ends; thickness was therefore controlled to 0.30 ± 0.03 mm at the finger end and 0.30 ± 0.05 mm at the connector end. Hard gold was required, yet the data contained two independent plating points; one point was processed as hard gold while a lead wire was added for the second point to complete the plating circuit.

 

Confirmed thickness control, single-piece shipment, and plating lead adjustments were implemented prior to production. The thin flex boards achieved consistent hard gold coverage and reliable stiffener adhesion within the planned timeline. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the revised mechanical and electrical requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FPC-20260403-077 Flexible PCB 1 25.83 x 65.93 Yellow ENIG (Immersion Gold) 25 View detail

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