PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Flexible PCB | Quantity | 1200 pcs |
| Layers | 2 Layers | Board Type | Single PCB |
| Dimensions | 215.75 x 11.94 mm | Copper Weight | 1/2OZ |
| Thickness | 0.13 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | OSP | Min Hole Size | 0.3mm↑ |
| Solder Mask | White | Silkscreen | None |
| Material | Electrolytic Copper | Stiffener | None |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This batch comprised 1200 units of 2-layer flexible circuits, each measuring 215.75 x 11.94 mm with a thin 0.13 mm profile using 1/2 oz copper. The design specified standard 6/6 mil traces, 0.3 mm holes, white soldermask, and OSP surface finish on polyimide material without stiffeners. These long, narrow circuits required particular attention during fabrication to preserve flexibility and flatness.
We focused on proper polyimide material handling prior to circuit imaging and etching. Coverlay lamination was followed by solder mask application and organic coating for the OSP treatment. Dynamic flex testing formed a key part of the process to validate endurance, alongside AOI inspection and electrical testing at multiple stages.
The 35-day production timeline supported thorough execution and verification for these flexible circuits, ensuring reliable performance characteristics and consistent quality across the full order quantity.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FPC-20260810-027 | Flexible PCB | 1 | 121.16 x 12.95 | Yellow | OSP | 50 | View detail |
| FPC-20260810-025 | Flexible PCB | 1 | 148.59 x 83.95 | Yellow | OSP | 50 | View detail |
| FPC-20260803-025 | Flexible PCB | 2 | 292.5 x 8.5 | Yellow | ENIG (Immersion Gold) | 1000 | View detail |
