Single Layer Flexible PCB Production Record #FPC-20260706-041

This flexible PCB order comprised 100 single-layer boards sized 100 × 14.6 mm at a finished thickness of 0.13 mm, built on rolled copper polyimide material. A PI stiffener was selectively applied to reinforce connector zones while preserving the circuit's inherent bend characteristics. Minimum 0.3 mm hole size and 6/6 mil track spacing represented conventional geometry for flex, allowing standard imaging and etching sequences to maintain tight registration across the thin substrate.

Yellow soldermask and hard gold plating were deposited after coverlay lamination to ensure clear contrast and reliable edge-contact durability. Polyimide material handling protocols were followed throughout to prevent wrinkling or distortion. Dynamic flex testing confirmed the circuits could endure repeated bending cycles without trace fracture, after which full electrical testing validated net continuity on every board.

The complete sequence—from engineering review through final test—required nine production days. Resulting parts exhibited consistent surface quality and dimensional stability suited to applications demanding both flexibility and long-term mechanical reliability.