PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | HDI PCB | Quantity | 10 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 121 x 164 mm | Copper Weight | 1oz |
| Thickness | 0.8 mm | Min Track / Spacing | 4/4mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.15mm |
| Solder Mask | Green | Silkscreen | White |
| HDI Structure | 2 | Blind/Buried Vias | No |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
We manufactured this 6-layer HDI PCB as panels, producing a quantity of 10 units sized 121 x 164 mm with an overall thickness of 0.8 mm and 1 oz copper. The 2-step HDI structure required sequential lamination and laser microvia drilling together with via filling and plating to form the interconnections at 4/4 mil minimum track and spacing. Material preparation and custom stackup planning preceded high-pressure lamination and layer stack alignment to maintain registration across the thin construction.
Green soldermask and white silkscreen were applied prior to surface finishing. We performed electroless nickel deposition followed by immersion gold deposition to create the ENIG finish, delivering a flat, solderable surface suited to the board geometry. Final electrical testing confirmed continuity and isolation across all microvias and traces.
The 24.4-day production window allowed measured execution of each process stage, resulting in consistent panels that matched the specified HDI parameters and custom stackup without deviation.
Explore More PCB Manufacturing Resources
6 Layer HDI PCB Manufacturing Insights
Discover how AIVON manufactures 6 Layer HDI PCBs, including advanced microvia technology, multilayer interconnection control, sequential lamination processes, manufacturing challenges, and real production experience from customer orders.
Multilayer HDI PCB Common Engineering Queries in Manufacturing
Multilayer HDI PCBs frequently trigger CAM EQs on microvia spacing, via-in-pad plugging, stack-up, and impedance. Learn real root causes and design rules that raise first-pass yield.
Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| HDI-20260729-036 | HDI PCB | 8 | 97 x 93.4 | Black | ENIG (Immersion Gold) | 100 | View detail |
| HDI-20260720-0001 | HDI PCB | 8 | 188 x 100 | Matte Black | ENIG (Immersion Gold) | 125 | View detail |
| HDI-20260718-0002 | HDI PCB | 4 | 37 x 26.6 | Green | ENIG (Immersion Gold) | 20 | View detail |
