PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | HDI PCB | Quantity | 125 pcs |
| Layers | 8 Layers | Board Type | Panel PCB |
| Dimensions | 170 x 100 mm | Copper Weight | 2oz |
| Thickness | 1.6 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.15mm |
| Solder Mask | Blue | Silkscreen | White |
| HDI Structure | 3 | Blind/Buried Vias | Yes |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This order for 125 panels of 8-layer HDI PCBs featured a custom stackup with blind vias in a 3-step configuration. Boards measured 170 x 100 mm with 1.6 mm thickness, 2 oz copper, and 5/5 mil minimum track and spacing. Such specifications necessitated meticulous inner layer imaging, circuit etching, and layer stack alignment to preserve the integrity of the fine geometries during sequential lamination.
Laser microvia drilling created the blind connections, after which via filling, plating, and thick copper electroplating were performed. Blue soldermask with white silkscreen was applied prior to the electroless nickel deposition and immersion gold ENIG surface finish. This combination ensures both functional performance and long-term reliability for the HDI PCB.
Throughout the 29.8-day production period, electrical testing at completion confirmed consistent results across the entire batch. Each manufacturing stage received focused attention to detail, delivering panels that fully satisfied the technical requirements without deviation.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| HDI-20260729-036 | HDI PCB | 8 | 97 x 93.4 | Black | ENIG (Immersion Gold) | 100 | View detail |
| HDI-20260720-0001 | HDI PCB | 8 | 188 x 100 | Matte Black | ENIG (Immersion Gold) | 125 | View detail |
| HDI-20260718-0002 | HDI PCB | 4 | 37 x 26.6 | Green | ENIG (Immersion Gold) | 20 | View detail |