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8 Layer HDI PCB Production Record #HDI-20260213-0016

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PCB Specifications

Parameter Value Parameter Value
PCB Type HDI PCB Quantity 125 pcs
Layers 8 Layers Board Type Panel PCB
Dimensions 170 x 100 mm Copper Weight 2oz
Thickness 1.6 mm Min Track / Spacing 5/5mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.15mm
Solder Mask Blue Silkscreen White
HDI Structure 3 Blind/Buried Vias Yes

Manufacturing Timeline

Order Created
Jan 13 11:53
Files Ready
Jan 13 11:53
Engineering Review Completed
Jan 13 12:34
Payment down
Jan 13 16:18
Production Started
Jan 13 16:18
Production Completed
Feb 12 10:40
Progress: 0/6
Engineering Review time: 0.7 h
Production time: 29.8d

Logistics Information

Production Completed→Shipping : 1.3d
Carrier
FedEx IP
Destination
HONG KONG,CHINA
Shipping Method
Express Air
Shipping Time
Feb 13 16:56

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Sequential Lamination
08
Laser Microvia Drilling
09
Via Filling & Plating
10
Thick Copper Electroplating
11
Controlled Copper Etching
12
Solder Mask Application
13
Electroless Nickel Deposition
14
Immersion Gold Deposition
15
Electrical Testing

Manufacturing Summary

This order for 125 panels of 8-layer HDI PCBs featured a custom stackup with blind vias in a 3-step configuration. Boards measured 170 x 100 mm with 1.6 mm thickness, 2 oz copper, and 5/5 mil minimum track and spacing. Such specifications necessitated meticulous inner layer imaging, circuit etching, and layer stack alignment to preserve the integrity of the fine geometries during sequential lamination.

 

Laser microvia drilling created the blind connections, after which via filling, plating, and thick copper electroplating were performed. Blue soldermask with white silkscreen was applied prior to the electroless nickel deposition and immersion gold ENIG surface finish. This combination ensures both functional performance and long-term reliability for the HDI PCB.

 

Throughout the 29.8-day production period, electrical testing at completion confirmed consistent results across the entire batch. Each manufacturing stage received focused attention to detail, delivering panels that fully satisfied the technical requirements without deviation.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
HDI-20260729-036 HDI PCB 8 97 x 93.4 Black ENIG (Immersion Gold) 100 View detail
HDI-20260720-0001 HDI PCB 8 188 x 100 Matte Black ENIG (Immersion Gold) 125 View detail
HDI-20260718-0002 HDI PCB 4 37 x 26.6 Green ENIG (Immersion Gold) 20 View detail

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