PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | HDI PCB | Quantity | 125 pcs |
| Layers | 8 Layers | Board Type | Panel PCB |
| Dimensions | 170 x 100 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.15mm |
| Solder Mask | Matte Black | Silkscreen | White |
| HDI Structure | 3 | Blind/Buried Vias | Yes |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
For this HDI circuit board order, 125 panels were produced with an 8-layer construction and 3-step HDI structure incorporating blind vias. The 170 x 100 mm boards at 1.6 mm thickness utilized a custom stackup with 1 oz copper weight. Sequential lamination and laser microvia drilling were employed to achieve the required interconnects while meeting the 5/5 mil track and spacing on this tighter geometry design.
A matte black soldermask paired with white silkscreen created the specified visual finish. Immersion gold ENIG was selected as the surface finish, with electroless nickel deposition and immersion gold steps ensuring uniform coverage on pads and vias. Following via filling, plating, and solder mask application, each panel underwent thorough electrical testing to verify performance.
The production flow, spanning 24 days, maintained alignment and registration throughout the high-pressure lamination stages. This resulted in reliable delivery of the custom HDI boards that fully satisfied the technical requirements for this project.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| HDI-20260729-036 | HDI PCB | 8 | 97 x 93.4 | Black | ENIG (Immersion Gold) | 100 | View detail |
| HDI-20260720-0001 | HDI PCB | 8 | 188 x 100 | Matte Black | ENIG (Immersion Gold) | 125 | View detail |
| HDI-20260718-0002 | HDI PCB | 4 | 37 x 26.6 | Green | ENIG (Immersion Gold) | 20 | View detail |
