8 Layer HDI PCB Production Record #HDI-20260330-0004

This order comprised five 8-layer HDI panels measuring 143.15 × 114.1 mm with 1.6 mm finished thickness and 2 oz copper on all layers. The 3-step HDI structure incorporating blind vias was built using sequential lamination and laser microvia drilling, followed by via filling and plating. We prepared a custom stackup to maintain layer registration during high-pressure lamination, while the 0.2 mm minimum hole size and standard 6/6 mil geometry required adjusted plating parameters to secure reliable interconnects.

Thick copper electroplating and controlled etching steps were executed to preserve trace integrity across the 2 oz layers. Matte green soldermask, white silkscreen, and immersion gold ENIG surface finish were applied in dedicated processes that ensured clean pad definition and solderability. Without impedance control, emphasis remained on consistent dielectric spacing and via reliability throughout the HDI PCB fabrication sequence.

After engineering review, material preparation, circuit imaging, and electrical testing, the panels completed production in 21 days. Each stage included verification steps that confirmed the finished boards met all dimensional, plating, and registration requirements for this specific HDI configuration.