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4 Layer Rigid-Flex PCB Production Record #RFP-20240925-0052

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 2000 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 100 x 210 mm Copper Weight 1OZ
Thickness 1 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen None

Manufacturing Timeline

Order Created
Aug 14 13:48
Files Ready
Aug 14 13:48
Engineering Review Completed
Aug 15 15:48
Payment down
Aug 15 15:48
Production Started
Aug 15 13:48
Production Completed
Aug 19 15:47
Progress: 0/6
Engineering Review time: 1.3d
Production time: 4.2d

Logistics Information

Production Completed→Shipping : 0.3 h
Carrier
DHL
Destination
BULGARIA
Shipping Method
Express Air
Shipping Time
Sep 25 17:41

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Panelization Optimization
14
Batch AOI Inspection
15
Yield Control Management
16
Electrical Testing

Manufacturing Summary

For this order, we manufactured 2000 panels of 4-layer rigid-flex PCBs, each panel sized at 100 by 210 millimeters. The boards incorporate 1 oz copper on a 1 mm overall thickness, following conventional 6/6 mil minimum track and spacing with 0.2 mm hole diameters. Application of green solder mask and immersion gold ENIG finish completed the surface requirements, calling for specialized handling during the rigid-to-flex transition zones.

 

The production sequence included careful layer stack alignment, flex-rigid lamination, and high pressure bonding to achieve stable multilayer construction without delamination risks. Controlled depth routing separated the rigid and flex areas precisely. Dynamic flex reliability testing confirmed the boards could withstand repeated bending cycles, supporting product longevity in end-use environments.

 

Throughout the 41-day build, batch AOI inspection, electrical testing, and yield management maintained high consistency across the entire quantity. This methodical execution delivered reliable rigid-flex circuits tailored to the customer's specifications.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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