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4 Layer Rigid-Flex PCB Production Record #RFP-20250626-0051

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 30 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 161 x 155 mm Copper Weight 2OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen None

Manufacturing Timeline

Order Created
Jun 06 08:59
Files Ready
Jun 06 08:59
Engineering Review Completed
Jun 06 09:23
Payment down
Jun 06 18:05
Production Started
Jun 10 18:36
Production Completed
Jun 26 15:27
Progress: 0/6
Engineering Review time: 0.4 h
Production time: 15.9d

Logistics Information

Production Completed→Shipping : 0.3 h
Carrier
DHL
Destination
GERMANY
Shipping Method
Express Air
Shipping Time
Jun 26 15:44

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Thick Copper Electroplating
09
Controlled Copper Etching
10
Solder Mask Application
11
Electroless Nickel Deposition
12
Immersion Gold Deposition
13
Controlled Depth Routing
14
Dynamic Flex Reliability Testing
15
Electrical Testing

Manufacturing Summary

This production run delivered 30 panels of 4-layer rigid-flex PCBs, each measuring 161 × 155 mm with a finished thickness of 1.6 mm and 2 oz copper throughout. The design followed standard 6/6 mil trace and spacing with 0.3 mm minimum holes, green soldermask, and immersion gold ENIG finish while omitting silkscreen. Material preparation and layer stack alignment received close attention to accommodate the differing thermal expansion rates between rigid FR-4 and flexible polyimide sections.

 

Flex-rigid lamination and high-pressure lamination steps were sequenced to maintain precise registration across the transition zones. Thick copper electroplating, followed by controlled copper etching, preserved trace profiles on the heavier copper weight. Dynamic flex reliability testing validated bend endurance, and 100 % electrical testing confirmed net integrity on every panel before controlled depth routing defined final outlines.

 

The order was completed in 15.9 days with stable dimensional and electrical results across the batch. The combination of ENIG plating and verified flex reliability supports consistent performance in applications requiring both mechanical flexibility and robust soldering interfaces.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260626-0002 Rigid-Flex PCB 4 100 x 106.01 Green ENIG (Immersion Gold) 5 View detail
RFP-20260608-0005 Rigid-Flex PCB 4 22.15 x 97.92 Green ENIG (Immersion Gold) 20 View detail
RFP-20260606-0038 Rigid-Flex PCB 4 180 x 120 Black ENIG (Immersion Gold) 5 View detail

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