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OSP Aluminum PCB Production Record #ALU-20260322-015

Start Aluminum PCB Quote

PCB Specifications

Parameter Value Parameter Value
PCB Type Aluminum PCB Quantity 5 pcs
Layers 1 Layers Board Type Panel PCB
Dimensions 225.2 x 225.2 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 10/10mil
Surface Finish OSP Min Hole Size 1.5mm↑
Solder Mask White Silkscreen Black
Thermal Conductivity 1.0W Voltage Withstand AC2500V

Manufacturing Timeline

Order Created
Mar 17 01:50
Files Ready
Mar 17 01:50
Engineering Review Completed
Mar 17 01:50
Payment down
Mar 17 02:18
Production Started
Mar 17 02:21
Production Completed
Mar 21 04:40
Progress: 0/6
Production time: 4.1d With Engineering Questions

Logistics Information

Production Completed→Shipping : 1.1d
Carrier
FedEx IP
Destination
BRAZIL
Shipping Method
Express Air
Shipping Time
Mar 22 06:15

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Metal Base Preparation
04
Circuit Imaging & Etching
05
Thermal Insulation Lamination
06
Solder Mask Application
07
Organic Coating Application
08
Anti-Oxidation Treatment
09
Heat Dissipation Control
10
Electrical Testing

Manufacturing Summary

This order comprised five single-layer aluminum PCBs produced in panel format, each measuring 225.2 × 225.2 mm with 1.6 mm thickness, 1 oz copper, and 1.0 W/mK thermal conductivity. The specification called for 10/10 mil trace and spacing, minimum 1.5 mm hole size, white solder mask, black silkscreen, and OSP surface finish to support AC 2500 V withstand voltage. These parameters required careful substrate selection and surface preparation to maintain consistent thermal transfer while preserving dielectric integrity across the large panel area.

 

We performed metal base preparation and circuit imaging followed by etching on the aluminum core, then applied thermal insulation lamination to bond the dielectric layer uniformly. Solder mask application, organic coating for the OSP finish, and anti-oxidation treatment were sequenced to protect the 1 oz copper features. Heat dissipation control steps during lamination and curing ensured the 1.0 W/mK performance was preserved without introducing stress or delamination risks.

 

Electrical testing at the end of the 4.1-day production cycle verified all five panels met both electrical and thermal requirements. The executed process delivered stable aluminum PCBs with reliable heat management characteristics for the intended application.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
ALU-20260715-003 Aluminum PCB 1 482 x 44 Black HASL Lead Free 5 View detail
ALU-20260531-057 Aluminum PCB 1 378.5 x 220.5 Black HASL Lead Free 125 View detail
ALU-20260524-021 Aluminum PCB 1 130 x 240 Warm White HASL Lead Free 20 View detail

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